3. DDR2 SDRAM Module Ordering Information. DDR2 SDRAM Memory. Org. Density Part Number 64Mx 72 512MB M395T6553GZ4.


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- 1 -
Apr. 2010
SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND
SPECIFICATIONS WITHOUT NOTICE.
Products and specifications
discussed herein are for reference pur
poses only. All info
herein is provided on an "AS IS" bas
is, without warranties of any kind.
This document and all information discussed herein re
main the sole and exclusive property of Samsung
Electronics. No license of
any patent, copyright, mask work, tradem
ark or any other intellectual property
right is granted by one party to the other party under
this document, by implication, estoppel or other-
wise.
Samsung products are not intended for use in life sup
- 2 -
Product GuideDDR2 SDRAM MemoryApr. 2010
1. DDR2 SDRAM MEMORY ORDERING INFORMATION
56
51
1G
1Gb
:
:
x 4 Stack
x 8 Stack
x16
x 4 Stack (JEDEC Standard)
x 8 Stack (JEDEC Standard)
4 Banks
8 Banks
3. DRAM Type
4. Density
5. Bit Organization
6. # of Internal Banks
9. Package Type
8. Revision
10. Temp & Power
1. SAMSUNG Memory : K
2. DRAM : 4
Revision
# of Internal Banks
Density
DRAM Type
SAMSUNG Memory
Package Type
Temp & Power
1 2 3 4 5 6 7 8 9 10 11
Speed
DDR2 SDRAM
Commercial Temp.( 0
C ~ 95
C) & Normal Power
Commercial Temp.( 0
C ~ 95
C) & Low Power
Commercial Temp.( 0
C ~ 95
C) & Low Voltage
FBGA (Lead-free)
FBGA DDP (Lead-free)
FBGA (Lead-free & Halogen-free)
FBGA DDP (Lead-free & Halogen-free)
FBGA DSP (Lead-free & Halogen-free, Thin)
FBGA (Lead-free & Halogen-free, Flip Chip)
1st Gen.
2nd Gen.
3rd Gen.
4th Gen.
5th Gen.
6th Gen.
7th Gen.
8th Gen.
9th Gen.
10th Gen.
17th Gen.
18th Gen.
11. Speed
:
DDR2-400 (200MHz @ CL=3, tRCD=3, tRP=3)
DDR2-533 (266MHz @ CL=4, tRCD=4, tRP=4)
:
DDR2-667 (333MHz @ CL=5, tRCD=5, tRP=5)
:
DDR2-800 (400MHz @ CL=6, tRCD=6, tRP=6)
:
DDR2-800 (400MHz @ CL=5, tRCD=5, tRP=5)
SSTL_18 (1.8V, 1.8V)
7. Interface ( V
16
27
- 3 -
Product GuideDDR2 SDRAM MemoryApr. 2010
2. DDR2 SDRAM Component Product Guide
Part Number
Package & Power, Temp.
(-C/-L) & Speed
Org.
PKG
Avail.
4Banks
K4T51043QIHCE7/F7/E6128M x 4
FBGA
K4T51083QIHCE7/F7/E664M x 8
K4T51163QIHCF8/E7/F7/E632M x 16
FBGA
1Gb Q-die8Banks
K4T1G044QQHC(L)E7/F7/E6256M x 4
FBGA
K4T1G084QQHC(L)E7/F7/E6128M x 8
K4T1G164QQHC(L)E7/F7/E664M x 16
FBGA
1Gb E-die8Banks
K4T1G044QEHC(L)E7/F7/E6256M x 4
FBGA
K4T1G084QEHC(L)E7/F7/E6128M x 8
K4T1G164QEHC(L)E7/F7/E664M x 16
FBGA
1Gb F-die8Banks
K4T1G044QFBCE7/F7/E6256M x 4
FBGA
Jun. 10
K4T1G084QFBCE7/F7/E6128M x 8
K4T1G164QFBCE7/F7/E664M x 16
FBGA
May. 10
2Gb A-die8Banks
K4T2G044QAHC(L)F7/E6512M x 4
FBGA
K4T2G084QAHC(L)F7/E6256M x 8
- 4 -
Product GuideDDR2 SDRAM MemoryApr. 2010
3. DDR2 SDRAM Module
Ordering Information
DIMM
SODIMM
240pin Unbuffered DIMM
240pin ECC unbuffered DIMM
240pin
VLP Registered DIMM
240pin
Registered DIMM
240pin Fully Buffered DIMM
200pin Unbuffered SODIMM
32M 33
32M (for 128Mb/512Mb)
64M 65
64M (for 128Mb/512Mb)
28
128M 29
128M (for 128Mb/512Mb)
56
256M 57
256M (for 512Mb/2Gb)
51
512M 52
512M (for 512Mb/2Gb)
1G
:
1G 1K
1G (for 2Gb)
:
Mother PCB
2nd Rev.
4th Rev.
1. Memory Module : M
2. DIMM Type
3. Data Bits
4. DRAM Component Type
5. Depth
12. Speed
11. Temp & Power
10. PCB Revision
8. Component Revision
4Banks & SSTL-1.8V
8Banks & SSTL-1.8V
6. # of Banks in comp. & Interface
1
1st Rev.
3
3rd Rev.
A
Parity DIMM
S
Reduced PCB
:
DDR2-400 (200MHz @ CL=3, tRCD=3, tRP=3)
DDR2-533 (266MHz @ CL=4, tRCD=4, tRP=4)
:
DDR2-667 (333MHz @ CL=5, tRCD=5, tRP=5)
DDR2-800 (400MHz @ CL=6, tRCD=6, tRP=6)
:
DDR2-800 (400MHz @ CL=5, tRCD=5, tRP=5)
Commercial Temp.( 0
C) & Normal Power
Commercial Temp.( 0
C) & Low Power
Commercial Temp.( 0
C) & Low Voltage
PCB Revision
Component Revision
# of Banks in Comp. & Interface
DRAM Component Type
Data bits
DIMM Type
Memory Module
Package
Temp & Power
Speed
1 2 3 4 5 6 7 8 9 10 11 12
13
Bit Organization
AMB Vendor
x 4
x 8
x 4 Stack (JEDEC Standard)
x 8 Stack (JEDEC Standard)
x 4 Stack
x 8 Stack
7. Bit Organization
13. AMB Vendor For FBDIMM
:
IDT
Montage
: PC2-6400(DDR2-800), PC2-5300(DDR2-667)
PC2-4200(DDR2-533), PC2-3200(DDR2-400)
1st Gen.
3rd Gen.
5th Gen.
7th Gen.
10th Gen.
18th Gen.
2nd Gen.
4th Gen.
6th Gen.
8th Gen.
FBGA(Lead-free)
FBGA DDP (Lead-free)
FBGA QDP (Lead-free)
FBGA (Lead-free & Halogen-free)
FBGA DDP (Lead-free & Halogen-free)
FBGA QDP (Lead-free & Halogen-free)
FBGA (Lead-free & Halogen-free, Flip Chip)
9. Package
- 5 -
Product GuideDDR2 SDRAM MemoryApr. 2010
4. DDR2 SDRAM Module Product Guide
240Pin DDR2 Unbuffered DIMM
Org.
Part Number
Speed
Composition
Comp.
Version
Internal
Height
Avail.
64Mx 64512MB
M378T6464QZ(H)3CE7/F7/E664M x16*4pcs1GbQ-die
FBGA
30mmNow
M378T6464EHSCE7/F7/E664M x16*4pcs1GbE-die1
128Mx 64
1GB
M378T2863QZ(H)SCE7/F7/E6
128M x8*8pcs
1GbQ-die
FBGA
M378T2863EHSCE7/F7/E61GbE-die
M378T2863FBSCE7/F7/E61GbF-dieJun. 10
128Mx 72
M391T2863QZ(H)3CE7/F7/E6
128M x8*9pcs
1GbQ-die
M391T2863EH3CE7/F7/E61GbE-die
M391T2863FB3CE7/F7/E61GbF-dieJun. 10
256Mx 64
2GB
M378T5663QZ(H)3CE7/F7/E6
128M x8*16pcs
1GbQ-die
FBGA
M378T5663EH3CE7/F7/E61GbE-die
M378T5663FB3CE7/F7/E61GbF-dieJun. 10
256Mx 72
M391T5663QZ(H)3CE7/F7/E6
128M x8*18pcs
1GbQ-die
M391T5663EH3CE7/F7/E61GbE-die
M391T5663FB3CE7/F7/E61GbF-dieJun. 10
512Mx 64
4GB
M378T5263AZ(H)3CF7/E6256M x8*16pcs2GbA-die
FBGA
30mmNow
512Mx 72M391T5263AZ(H)3CF7/E6256M x8*18pcs2GbA-die
- 6 -
Product GuideDDR2 SDRAM MemoryApr. 2010
200Pin DDR2 SODIMM
Org.
Part Number
Speed
Composition
Comp.
Version
Internal
PKG
Height
Avail.
64Mx 64512MB
M470T6464QZ(H)3C(L)E7/F7/E6
64M x16*4pcs
1GbQ-die
FBGA
30mmNow
M470T6464EHSC(L)E7/F7/E61GbE-die
M470T6554IH3CE632M x16*8pcs512MbI-die42
128Mx 641GB
M470T2864QZ(H)3C(L)E7/F7/E6
64M x16*8pcs
1GbQ-die
FBGA
M470T2864EH3C(L)E7/F7/E6
1GbE-die
M470T2863EH3C(L)E7/F7/E6
128M x 8*8pcs1
FBGA
M470T2863FB3CE7/F7/E61GbF-dieMay. 10
256Mx 642GB
M470T5663QZ(H)3C(L)E7/F7/E6
128M x 8*16pcs
1GbQ-die
FBGA30mm
M470T5663EH3C(L)E7/F7/E61GbE-die
M470T5663FB3CE7/F7/E61GbF-dieMay. 10
512Mx 644GBM470T5267AZ(H)3C(L)F7/E6st.512M x 8*8pcs2GbA-die82
FBGA
30mmNow
- 7 -
Product GuideDDR2 SDRAM MemoryApr. 2010
240Pin DDR2 Registered DIMM
Org.
Density
Part Number
Speed
Composition
Version
Internal
Banks
Rank
PKG
Height
Avail.
128Mx 721GB
M393T2863QZ(H)3CD5/CC
128M x8*9pcs
1GbQ-die81
60 ball
M393T2863QZ(H)ACE7/F7/E6
M393T2863FB3CE7/F7/E61GbF-die81Jun. 10
256Mx 722GB
M393T5663QZ3CD5/CC
128M x8*18pcs
1GbQ-die
60 ball
M393T5663QZ(H)ACE7/F7/E6
M393T5660QZ3CD5/CC
256M x4*18pcs1
M393T5660QZ(H)ACE7/F7/E6
M393T5660FB3CE7/F7/E61GbF-dieJun. 10
512Mx 724GB
M393T5160QZ3CD5/CC
256M x4*36pcs
1GbQ-die
60 ball
M393T5160QZ(H)ACE7/F7/E6
M393T5160FB3CE7/F7/E61GbF-dieJun. 10
M393T5260AZ(H)ACF7/E6512M x4*18pcs2GbA-die1
68 ball
1Gx 728GB
M393T1G60QJ(M)ACE6/D5DDP 512M x4*36pcs1GbQ-die
63 ball
30mmNow
M393T1K66AZ(H)ACF7/E6st.1G x4*18pcs2GbA-die2
83 ball
- 8 -
Product GuideDDR2 SDRAM MemoryApr. 2010
240Pin DDR2 VLP Registered DIMM
Org.
Density
Part Number
Speed
Composition
Version
Internal
Banks
Rank
PKG
Avail.
64Mx 72512MBM392T6553GZACF7/E664M x8*9pcs512MbG-die4 1
60 ball
FBGA
18.3mmNow
128Mx 721GB
M392T2863QZ(H)ACF7/E6
128M x8*9pcs
1GbQ-die
60 ball
FBGA
18.3mm
M392T2863FBACE7/F7/E61GbF-dieJun. 10
256Mx 722GB
M392T5660QZ(H)ACF7/E6
256M x4*18pcs
1GbQ-die
60 ball
FBGA
18.3mm
M392T5660FBACE7/F7/E61GbF-dieJun. 10
M392T5663QZ(H)ACF7/E6
128M x8*18pcs
1GbQ-die
M392T5663FBACE7/F7/E61GbF-dieJun. 10
512Mx 724GBM392T5160QJ(M)ACF7/E6DDP 512M x4*18pcs1GbQ-die82
63 ball
FBGA
18.3mmNow
1Gx 728GBM392T1G60QQ(E)ACE6/D5QDP 1G x4*18pcs1GbQ-die84
65 ball
FBGA
18.3mmNow
- 9 -
Product GuideDDR2 SDRAM MemoryApr. 2010
240Pin DDR2 Fully Buffered DIMM(
1.8V
Org.
Density
Part Number
Speed
Composition
Comp.
Version
Internal
Height
Avail.
64Mx 72512MBM395T6553GZ4
CE7/F7/E66 : IDT C1
64M x 8*9pcs512MbG-die41
60 ball
30.35mmNow
CE65 : Intel D1
128Mx 721GB
M395T2863QZ(H)4
CE7/F7/E66 : IDT C1
128M x 8*9pcs
1GbQ-die
60 ball
30.35mm
CE7/F7/E68: IDT L4
CE65 : Intel D1
M395T2863FB4CE7/F7/E6
6 : IDT C1
1GbF-dieJun. 10
8: IDT L4
256Mx 722GB
M395T5663QZ(H)4
CE7/F7/E66 : IDT C1
128M x 8*18pcs
1GbQ-die
60 ball
30.35mm
CE7/F7/E68: IDT L4
CE6
5 : Intel D1
3: Montage D3
M395T5663FB4CE7/F7/E6
6 : IDT C1
1GbF-dieJun. 10
8: IDT L4
512Mx 724GB
M395T5160QZ(H)4
CE7/F7/E66 : IDT C1
256M x4*36pcs
1GbQ-die
60 ball
30.35mm
CE68: IDT L4
CE6
5 : Intel D1
3: Montage D3
M395T5160FB4CE7/F7/E6
6 : IDT C1
1GbF-dieJun. 10
8: IDT L4
M395T5163QZ(H)4CE7/F7/E68: IDT L4
128M x 8*36pcs
1GbQ-die
M395T5163FB4CE7/F7/E6
6 : IDT C1
1GbF-dieJun. 10
8: IDT L4
M395T5263AZ(H)4
CF7/E66 : IDT C1
256M x8*18pcs2GbA-die2
68 ball
CF7/E68: IDT L4
1Gx 728GB
M395T1G60QJ(M)4CE6/F78: IDT L4DDP 512M x4*36pcs1GbQ-die
63 ball
30.35mmNow
M395T1K66AZ(H)4
CF7/E6/D56 : IDT C1
st.1G x4*18pcs2GbA-die2
83 ball
CF7/E68: IDT L4
- 10 -
Product GuideDDR2 SDRAM MemoryApr. 2010
240Pin DDR2 Fully Buffered DIMM(
1.55V
Org.
Part Number
Speed
Composition
Comp.
Version
Internal
Avail.
128Mx 721GBM395T2863QZ(H)4YE68: IDT L464M x 8*18pcs1GbQ-die81
60 ball
30.35mmNow
256Mx 722GBM395T5663QZ(H)4YE68: IDT L4128M x 8*18pcs1GbQ-die82
60 ball
30.35mmNow
512Mx 724GB
M395T5160QZ(H)4YE68: IDT L4256M x4*36pcs
1GbQ-die
260 ball
30.35mmNow
M395T5163QZ(H)4YE68: IDT L4128M x 8*36pcs4
M395T5263AZ(H)4YE68: IDT L4256M x8*18pcs2GbA-die2
68 ball
1Gx 728GBM395T1K66AZ(H)4YE68: IDT L4st.1G x4*18pcs2GbA-die82
83 ball
30.35mmNow
- 11 -
Product GuideDDR2 SDRAM MemoryApr. 2010
5. Package Dimension
11.00 0.10
9.00 0.10
#A1
0.500.05
0.350.05
1.100.10
(0.95)
# A1 INDEX MARK
(1.90)
11.00 0.10
0.80 x 10 = 8.00
0.80
987654321
9.00 0.10
1.60
0.80 x 8 = 6. 40
1.60
0.80
B
C
D
E
F
H
J
K
L
G
0.10MAX
60Ball FBGA for 1Gb Q-die (x4/x8)
BottomTop
84Ball FBGA for 1Gb Q-die (x16)
(0.95)
# A1 INDEX MARK
(1.90)
13.00 0.10
0.80 x 14 = 11.20
0.80
987654321
1.60
0.80 x 8 = 6. 40
1.60
0.80
B
C
D
E
F
H
J
K
L
M
N
P
R
G
13.00 0.10
9.00 0.10
#A1
0.500.05
0.350.05
1.100.10
0.10MAX
9.00 0.10
BottomTop
- 12 -
Product GuideDDR2 SDRAM MemoryApr. 2010
60Ball FBGA for 1Gb E-die (x4/x8)
(0.95)
# A1 INDEX MARK
(1.90)
9.50 0.10
0.80 x 10 = 8.00
0.80
7.50 0.10
1.60
0.80 x 8 = 6. 40
4.00
0.80
A
B
C
D
E
F
H
J
K
L
G
3.20
0.80
987654321
60-
0.45 Solder ball
0.2
(Post reflow 0.50
0.05)
MOLDING AREA
(Datum A)
(Datum B)
9.50 0.10
7.50 0.10
#A1
0.350.05
1.100.10
0.10MAX
BottomTop
84Ball FBGA for 1Gb E-die (x16)
(0.95)
# A1 INDEX MARK
(1.90)
12.50 0.10
0.80 x 14 = 11.20
0.80
7.50 0.10
1.60
0.80 x 8 = 6. 40
4.00
0.80
A
B
C
E
F
H
J
K
L
G
3.20
0.80
987654321
0.45 Solder ball
0.2
(Post reflow 0.50
0.05)
MOLDING AREA
(Datum A)
(Datum B)
12.50 0.10
7.50 0.10
#A1
0.350.05
1.100.10
0.10MAX
BottomTop
- 13 -
Product GuideDDR2 SDRAM MemoryApr. 2010
60Ball FBGA for 1Gb F-die (x4/x8)
BottomTop
BottomTop
84Ball FBGA for 1Gb F-die (x16)
(0.30)
# A1 INDEX MARK
(0.60)
9.50 0.10
0.80 x 10 = 8.00
0.80
7.50 0.10
1.60
0.80 x 8 = 6. 40
4.00
0.80
A
B
C
D
E
F
H
J
K
L
G
3.20
0.80
987654321
60-
0.48 Solder ball
0.2
(Post reflow 0.50
0.05)
MOLDING AREA
(Datum A)
(Datum B)
9.50 0.10
7.50 0.10
#A1
0.370.05
1.100.10
0.10MAX
12.50 0.10
7.50 0.10
#A1
0.370.05
1.100.10
0.10MAX
(0.30)
# A1 INDEX MARK
(0.60)
12.50 0.10
0.80 x 14 = 11.20
0.80
7.50 0.10
1.60
0.80 x 8 = 6. 40
5.60
0.80
A
B
C
E
F
H
J
K
L
G
3.20
0.80
987654321
84-
0.48 Solder ball
0.2
(Post reflow 0.50
0.05)
MOLDING AREA
(Datum A)
(Datum B)
- 14 -
Product GuideDDR2 SDRAM MemoryApr. 2010
BottomTop
(0.95)
# A1 INDEX MARK
(1.90)
18.00 0.10
8.00
0.80
11.00 0.10
0.80
1.60
3.20
0.80 x 18 = 14.40
7.20
18.00 0.10
11.00 0.10
0.10MAX
0.35 0.05
1.10 0.10
987654321
B
C
E
F
H
J
K
L
M
N
P
R
G
T
U
V
W
0.45 Solder ball
0.2
(Post reflow 0.50
0.05)
0.80 x 8 = 6.40
(Datum A)
(Datum B)
MOLDING AREA
68Ball FBGA for 2Gb A-die (x4/x8)


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разработчикам, и инженерам.



Конструкторский

отдел помогает осуществить:



Регистрацию

проекта у производителя компонентов
.



Техническую

поддержку

проекта
.



Защиту

от снятия компонента с производства
.



Оценку

стоимости проекта по компонентам
.



Изготовление тестовой платы монтаж и
пусконаладочные работы
.









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